US 12,439,188 B2
Micro-electro-mechanical systems (MEMS) microphone assembly
Yu Du, Novi, MI (US)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Appl. No. 17/919,839
Filed by HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED, Stamford, CT (US)
PCT Filed Apr. 22, 2020, PCT No. PCT/US2020/029278
§ 371(c)(1), (2) Date Oct. 19, 2022,
PCT Pub. No. WO2021/216058, PCT Pub. Date Oct. 28, 2021.
Prior Publication US 2023/0156386 A1, May 18, 2023
Int. Cl. H04R 1/04 (2006.01); B81B 3/00 (2006.01); H04R 1/08 (2006.01); H05K 1/18 (2006.01)
CPC H04R 1/04 (2013.01) [B81B 3/0021 (2013.01); H04R 1/083 (2013.01); H05K 1/181 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A microphone assembly comprising:
an enclosure;
a first printed circuit board (PCB); and
a microphone sub-assembly including:
a sub-casing;
a micro-electro-mechanical systems (MEMS) transducer positioned in the sub-casing; and
a second PCB to support the MEMS transducer,
wherein the second PCB defines a first audio port positioned directly below the MEMS transducer;
wherein the first PCB defines a first acoustic path positioned below the second PCB and the MEMS transducer and axially aligned with the first audio port and;
wherein the enclosure defines a first acoustic opening that is positioned directly below the first acoustic path to enable an audio input signal to pass through the first audio port and to an underside of the MEMS transducer;
wherein the enclosure defines a second acoustic opening that is positioned at a distance of between 3 to 30 mm from the first acoustic opening; and
wherein the sub-casing defines at least one port hole positioned on a top side thereof, and wherein the enclosure includes a post positioned over the at least one port hole to seal the sub-casing.