US 12,439,143 B1
Camera module and electronic device
Shi Xiong, Yuyao (CN); Peng Lu, Yuyao (CN); Kai Chen, Yuyao (CN); Jie Yu, Yuyao (CN); Qianjin Cao, Yuyao (CN); Yuxiang Wang, Yuyao (CN); and Cong Chen, Yuyao (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD, Yuyao (CN)
Filed by NINGBO SUNNY OPOTECH CO., LTD, Yuyao (CN)
Filed on May 9, 2025, as Appl. No. 19/203,197.
Claims priority of application No. 202411441911.8 (CN), filed on Oct. 16, 2024.
Int. Cl. H04N 23/55 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01)
CPC H04N 23/55 (2023.01) [H04N 23/51 (2023.01); H04N 23/54 (2023.01)] 18 Claims
OG exemplary drawing
 
1. A camera module comprising:
a photosensitive assembly comprising a support substrate, a photosensitive chip, and a molded part injection-molded on the support substrate; and
a lens assembly comprising an insert base and an optical lens disposed on the insert base and located in a photosensitive path of the photosensitive chip; the insert base comprises a base body and an insert body embedded in the base body, the base body is fixed to the support substrate and defines a cavity together with the support substrate;
wherein the molded part comprises a molded base located in the cavity on an inner side of a peripheral edge of the support substrate, and a first protrusion extended outward from the molded base to outside the cavity, and the insert body and the first protrusion are staggered with each other in a circumferential direction of the base body, so as to allow the insert body and the first protrusion to overlap with each other in a height direction of the camera module.