US 12,438,993 B2
Ultrasonic device
Masayoshi Yamada, Shiojiri (JP); Hikaru Iwai, Matsukawa-machi (JP); Shigeaki Muramatsu, Nagano (JP); and Toshiya Okada, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Dec. 27, 2022, as Appl. No. 18/146,474.
Claims priority of application No. 2021-212433 (JP), filed on Dec. 27, 2021.
Prior Publication US 2023/0208990 A1, Jun. 29, 2023
Int. Cl. H04N 1/00 (2006.01); B06B 1/06 (2006.01)
CPC H04N 1/00732 (2013.01) [H04N 1/00551 (2013.01); H04N 1/00689 (2013.01); H04N 1/00909 (2013.01); B06B 1/0662 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An ultrasonic device, comprising:
an ultrasonic element configured to perform at least one of transmission of an ultrasonic wave along a first axis or reception of the ultrasonic wave along the first axis; and
a protective member provided on the first axis to cover the ultrasonic element, wherein
the protective member has:
a first surface provided with at least one hole through which the ultrasonic wave travelling along the first axis passes, and
a second surface intersecting with the first surface,
the second surface is provided with a first opening through which foreign matter entering from the at least one hole is discharged,
the protective member further has a third surface intersecting with the first surface,
the third surface faces the second surface,
the ultrasonic element is between the third surface and the second surface, and
the third surface is provided with a second opening through which the foreign matter entering from the at least one hole is discharged.