US 12,438,654 B2
Communication system between dies and repairing method for lanes between dies
Igor Elkanovich, Hsinchu (TW); Yung-Sheng Fang, Hsinchu (TW); and Pei Yu, Hsinchu (TW)
Assigned to Global Unichip Corporation, Hsinchu (TW); and Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Global Unichip Corporation, Hsinchu (TW); and Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 6, 2023, as Appl. No. 18/347,595.
Prior Publication US 2025/0015939 A1, Jan. 9, 2025
Int. Cl. H04L 1/22 (2006.01); H04L 1/00 (2006.01)
CPC H04L 1/22 (2013.01) [H04L 1/001 (2013.01); H04L 1/0047 (2013.01)] 24 Claims
OG exemplary drawing
 
13. A repairing method for lanes between dies, comprising:
transmitting at least one first data unit stream by a first transmitting device disposed on a first die to a first receiving device disposed on a second die through at least one native lane, wherein the first die and the second die are disposed in a same integrated circuit package;
transmitting, by the first transmitting device, at least one synchronization flag to the first receiving device through a redundant lane to notify a repair time point during a continuous transmission process of the at least one first data unit stream and after one of the at least one native lane is determined to be a degraded lane;
using, by the first transmitting device, the redundant lane instead of the degraded lane based on the repair time point to continue data unit stream transmission of the first transmitting device during the continuous transmission process of the at least one first data unit stream; and
using, by the first receiving device, the redundant lane instead of the degraded lane based on the repair time point notified by the at least one synchronization flag to continue data unit stream reception of the first receiving device during the continuous transmission process of the at least one first data unit stream.