US 12,438,564 B2
Radio frequency module and communication device
Takanori Uejima, Kyoto (JP); Yuji Takematsu, Kyoto (JP); Dai Nakagawa, Kyoto (JP); and Yukiya Yamaguchi, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Apr. 18, 2023, as Appl. No. 18/302,032.
Application 18/302,032 is a continuation of application No. PCT/JP2021/030583, filed on Aug. 20, 2021.
Claims priority of application No. 2020-189693 (JP), filed on Nov. 13, 2020.
Prior Publication US 2023/0261678 A1, Aug. 17, 2023
Int. Cl. H04B 7/00 (2006.01); H04B 1/00 (2006.01); H04B 1/04 (2006.01)
CPC H04B 1/0078 (2013.01) [H04B 1/0458 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio frequency module, comprising:
a mounting substrate having a first main surface and a second main surface opposite to each other;
a filter mounted on the first main surface of the mounting substrate; and
a conductive member covering at least a part of a main surface of the filter on a side opposite to the mounting substrate,
wherein the first main surface of the mounting substrate has a first recess,
the main surface of the filter is in contact with the conductive member, and
at least a part of the filter is positioned inside the first recess.