US 12,438,515 B2
Resonator device having a heater
Norio Nomura, Minowa (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Apr. 26, 2022, as Appl. No. 17/729,068.
Claims priority of application No. 2021-074722 (JP), filed on Apr. 27, 2021.
Prior Publication US 2022/0345106 A1, Oct. 27, 2022
Int. Cl. H03H 9/08 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/19 (2006.01)
CPC H03H 9/08 (2013.01) [H03H 9/0557 (2013.01); H03H 9/1021 (2013.01); H03H 9/19 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A resonator device comprising:
a substrate provided with a first surface and a second surface located at an opposite side to the first surface;
a heater disposed at the first surface of the substrate;
a temperature sensor disposed at the first surface of the substrate;
a resonator element which is arranged at the first surface of the substrate, and has a first bond part bonded to the substrate;
a lid which is bonded to the substrate to form an internal space together with the substrate, the internal space accommodating the heater, the temperature sensor, and the resonator element; and
a circuit which is disposed at either one of the first surface and the second surface, and is provided with a temperature control circuit configured to control the heater based on an output of the temperature sensor, wherein
the first bond part is arranged to overlap the heater in a plan view from a direction perpendicular to the first surface.