US 12,438,508 B2
Radio-frequency module
Yuji Takematsu, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Apr. 6, 2023, as Appl. No. 18/296,669.
Application 18/296,669 is a continuation of application No. PCT/JP2021/037686, filed on Oct. 12, 2021.
Claims priority of application No. 2020-195153 (JP), filed on Nov. 25, 2020.
Prior Publication US 2023/0261618 A1, Aug. 17, 2023
Int. Cl. H03F 3/195 (2006.01); H03F 1/56 (2006.01)
CPC H03F 3/195 (2013.01) [H03F 1/565 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a first base including electrical circuits, wherein at least a part of the first base is made of a first semiconductor material having a first thermal conductivity;
a second base including a power amplifier circuit, wherein at least a part of the second base is made of a second semiconductor material having a second thermal conductivity lower than the first thermal conductivity;
a first matching component arranged outside the first base and the second base and including a first matching element connected to the power amplifier circuit; and
a module substrate having a main surface, wherein the first base, the second base, and the first matching component are arranged on the main surface,
wherein the first matching element includes at least one of an inductor and a capacitor,
wherein the first base is joined to the main surface via a first electrode,
wherein the second base is arranged between the module substrate and the first base in a sectional view and is joined to the main surface via a second electrode, and
wherein at least the part of the first base is overlapped with at least the part of the second base in a plan view.