US 12,438,478 B2
Hermetically sealed piezoelectric device with integrated temperature sensor and optimized thermal characteristics
Takahiro Ueta, Kyoto (JP); and Motoharu Ando, Kyoto (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Filed by KYOCERA Corporation, Kyoto (JP)
Filed on Jan. 24, 2023, as Appl. No. 18/158,578.
Application 18/158,578 is a continuation of application No. PCT/JP2021/027163, filed on Jul. 20, 2021.
Claims priority of application No. 2020-128278 (JP), filed on Jul. 29, 2020.
Prior Publication US 2023/0163702 A1, May 25, 2023
Int. Cl. H02N 2/00 (2006.01)
CPC H02N 2/008 (2013.01) [H02N 2/005 (2013.01); H02N 2/009 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A piezoelectric device comprising:
a piezoelectric element;
a mounting plate;
an electronic element comprising a temperature sensor therein;
a base on which the piezoelectric element is mounted with the mounting plate therebetween, and on which the electronic element is mounted, wherein the base comprises:
a substrate comprising a first bottom surface on which the electronic element is mounted;
a first frame located on an outer peripheral edge of the first bottom surface and comprising a second bottom surface on which the piezoelectric element is mounted with the mounting plate therebetween; and
a second frame located on an outer peripheral edge of the second bottom surface; and
a lid joined to the base and hermetically sealing at least the piezoelectric element and the mounting plate, wherein the lid is joined to the second frame and hermetically seals the piezoelectric element, the mounting plate, and the electronic element.