US 12,438,310 B2
Electronic device and socket module and metal shielding frame thereof
Chih-Chun Liu, Hsinchu (TW); Wei-Jie Huang, Hsinchu (TW); Jyun-Kai Huang, Hsinchu (TW); and Chun-Yu Lee, Hsinchu (TW)
Assigned to WISTRON NEWEB CORP., Hsinchu (TW)
Filed by Wistron NeWeb Corp., Hsinchu (TW)
Filed on Jul. 28, 2022, as Appl. No. 17/815,819.
Claims priority of application No. 110145608 (TW), filed on Dec. 7, 2021.
Prior Publication US 2023/0178939 A1, Jun. 8, 2023
Int. Cl. H01R 13/6583 (2011.01); H01R 13/422 (2006.01)
CPC H01R 13/6583 (2013.01) [H01R 13/4226 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a metal housing;
a circuit board, disposed in the metal housing;
a socket, disposed on the circuit board, wherein the socket comprises a socket case and a socket joint, and the socket case surrounds the socket joint; and
a metal shielding frame, comprising a sleeve-shaped frame body and at least one ground hemming portion, wherein the sleeve-shaped frame body comprises a first enclosed edge, the ground hemming portion is formed on the first enclosed edge, the sleeve-shaped frame body is located between the socket case and the socket joint, and the ground hemming portion abuts the metal housing,
wherein a plurality of protrusions are formed on an inner wall of the sleeve-shaped frame body, and there is no opening formed on the inner wall.