| CPC H01R 12/79 (2013.01) [H01Q 1/273 (2013.01); H01R 12/714 (2013.01); H01R 13/631 (2013.01); H01R 13/646 (2013.01)] | 8 Claims |
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1. A device for connecting RF signal between a first and a second microwave element, the device comprising coupling interfaces, wherein the device is arranged to facilitate said connection with less than 2 dB coupling loss between said interfaces at a first frequency, wherein
the device is a connector arrangement that comprises a first and a second layered member structured to be mated with a fixturing member of the device, and said first and second layered member being isolated by a coupling membrane of the device,
wherein the first layered member comprises a first mating aperture, arranged to receive the RF signal from the first microwave element via first of the coupling interfaces, and
the second layered member comprises a second mating aperture, arranged to connect the received RF signal to the second microwave element via second of the coupling interfaces, and
the first layered member comprises at least two conductor edges that border the first mating aperture with conductor areas, wherein the at least two conductor edges of the first layered member are arranged to receive the RF signal from the first microwave element at a first frequency under mating, and the second layered member comprises at least two conductor edges that border the second mating aperture with conductor areas, wherein, the structuring of the conductor areas bordering said mating apertures is configured such that the interlaced or overlapped surface area between one of the two mated conductor area pairs bordering the opposite mating apertures exceeds the interlaced or overlapped surface area shared by the mated mating apertures.
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