US 12,438,292 B2
Electronic device
Hitoshi Ueno, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Nov. 10, 2023, as Appl. No. 18/506,538.
Claims priority of application No. 2022-180841 (JP), filed on Nov. 11, 2022.
Prior Publication US 2024/0162637 A1, May 16, 2024
Int. Cl. H01R 12/57 (2011.01); H05K 1/18 (2006.01); G01C 19/5783 (2012.01)
CPC H01R 12/57 (2013.01) [H05K 1/181 (2013.01); G01C 19/5783 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10454 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a substrate having a first surface and a second surface in a front-back relation with each other;
a first electronic component mounted on the second surface; and
a lead located at the second surface side of the substrate and joined to the second surface via a conductive joint member, wherein
the lead includes a base end portion extending in a direction along the substrate and joined to the second surface via the joint member, a distal end portion located distally from the substrate with respect to the base end portion in a thickness direction of the substrate and having a terminal surface, and a coupling portion coupling the base end portion and the distal end portion, and
θ1>θ2, wherein, as seen from a direction orthogonal to a plane along which the lead extends, an angle formed by a line connecting an outermost position in which the joint member contacts the base end portion and an outer edge of the substrate and the base end portion is θ1, a distance between the first electronic component and the terminal surface in the thickness direction of the substrate is d1, a distance between a boundary part between the base end portion and the coupling portion and the joint member in the direction along the substrate is d2, and arctan(d1/d2)=θ2.