US 12,438,266 B2
Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof
Shao-Tzu Tang, Taichung (TW); Chih-Hsien Chiu, Taichung (TW); Wen-Jung Tsai, Taichung (TW); Ko-Wei Chang, Taichung (TW); and Chia-Chu Lai, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jul. 10, 2024, as Appl. No. 18/769,067.
Application 18/769,067 is a continuation of application No. 17/748,957, filed on May 19, 2022, granted, now 12,068,535.
Claims priority of application No. 111108211 (TW), filed on Mar. 7, 2022.
Prior Publication US 2024/0364001 A1, Oct. 31, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/48 (2006.01); H01Q 1/38 (2006.01); H01Q 1/50 (2006.01)
CPC H01Q 1/48 (2013.01) [H01Q 1/38 (2013.01); H01Q 1/50 (2013.01)] 39 Claims
OG exemplary drawing
 
1. An antenna module, comprising:
a plate body;
a plurality of antenna structures arrayed on the plate body; and
at least one shielding structure disposed on the plate body and located between the two adjacent antenna structures, wherein the plate body, the plurality of antenna structures and the at least one shielding structure form a substrate, wherein the at least one shielding structure includes a concave portion disposed on the plate body and a dielectric material located between the concave portion and the plurality of antenna structures, wherein the plate body has a metal portion exposed from sidewalls of the concave portion.