US 12,438,248 B2
Waveguide interface and non-galvanic waveguide transition for microcircuits
Mikael Hörberg, Torslanda (SE); Yinggang Li, Askim (SE); and Ola Tageman, Gothenburg (SE)
Assigned to Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
Filed by Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
Filed on May 26, 2023, as Appl. No. 18/202,428.
Application 18/202,428 is a continuation of application No. 17/047,835, granted, now 11,664,569, previously published as PCT/EP2019/058982, filed on Apr. 9, 2019.
Claims priority of provisional application 62/659,198, filed on Apr. 18, 2018.
Prior Publication US 2024/0030581 A1, Jan. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01P 5/08 (2006.01); H01P 3/08 (2006.01); H01P 3/12 (2006.01)
CPC H01P 5/08 (2013.01) [H01P 3/08 (2013.01); H01P 3/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A metalized waveguide interface for providing a galvanically isolated waveguide connection between a first waveguide and a second waveguide, the second waveguide being a metalized chip-level waveguide having a rectangular chip-level waveguide opening, the metalized waveguide interface comprising;
a support part comprising a support surface for mounting the second waveguide;
a transition part comprising a first face comprising a first rectangular waveguide opening, connectable to a waveguide opening of the first waveguide, and further comprising a second face comprising a second rectangular waveguide opening, in communication with the first rectangular waveguide opening through a cavity in the transition part; and
a connecting part connecting the support part to the transition part so as to space apart the support part and the transition part, with a trench between an edge of the support surface closest to the second face of the transition part and the second face of the transition part;
wherein the support part, transition part, and connecting part are arranged so that when the second waveguide is mounted to the support surface with the rectangular chip-level waveguide opening facing the second rectangular waveguide opening across the trench, first, second, and third open-ended waveguides and a short-circuit waveguide are formed by the second face of the transition part, the second waveguide, and the trench, the first and second open-ended waveguides extending along the trench, away from opposite first and third sides of the second rectangular waveguide opening, respectively, and the third open-ended waveguide extending away from a second side of the second rectangular waveguide opening in a direction away from the trench, and the short-circuit waveguide extending from a fourth side of the second rectangular waveguide opening, opposite the second side, in a direction into the trench.