US 12,438,134 B2
Package substrate and semiconductor package including the same
Junwoo Park, Anyang-si (KR); Sangsoo Kim, Cheonan-si (KR); Seunghwan Kim, Anyang-si (KR); Jungjoo Kim, Daegu (KR); and Yongkwan Lee, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jul. 12, 2022, as Appl. No. 17/862,586.
Claims priority of application No. 10-2021-0144641 (KR), filed on Oct. 27, 2021.
Prior Publication US 2023/0131730 A1, Apr. 27, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01)
CPC H01L 25/16 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/642 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/162 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/182 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19101 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a package substrate including:
a base substrate including a redistribution layer and having a front surface and a rear surface opposite to the front surface,
front pads disposed on the front surface and electrically connected to the redistribution layer,
rear pads disposed on the rear surface and electrically connected to the redistribution layer, and the rear pads including first rear pads and second rear pads,
a front protective layer including front openings respectively exposing the front pads on the front surface, and
a rear protective layer including a mounting region in which first rear openings respectively exposing the first rear pads and a second rear opening exposing the second rear pads and a portion of the rear surface are disposed on the rear surface;
a semiconductor chip disposed on the front protective layer and connected to the front pads;
a passive device disposed on the mounting region of the rear protective layer, and connected to the rear pads;
connection bumps disposed on the rear surface adjacent to the passive device, and electrically connected to the redistribution layer; and
a sealing material spaced apart from the connection bumps, covering a portion of the passive device, and extending into the second rear opening,
wherein four first rear openings of the first rear openings are respectively disposed adjacent to respective corners of the mounting region,
wherein the second rear opening is disposed to divide the four first rear openings into at least two groups,
wherein the first rear openings and the second rear opening are included in the mounting region, and
wherein the first rear pads corresponding to the first rear openings and the second rear pads corresponding to the second rear opening are disposed in the mounting region.