US 12,438,121 B2
Sintering materials and attachment methods using same
Oscar Khaselev, Monmouth Junction, NJ (US); Bawa Singh, Marlton, NJ (US); Bin Mo, East Brunswick, NJ (US); Michael T. Marczi, Chester, NJ (US); and Monnir Boureghda, East Stroudsburg, PA (US)
Assigned to ALPHA ASSEMBLY SOLUTIONS INC., Waterbury, CT (US)
Filed by ALPHA ASSEMBLY SOLUTIONS INC., South Plainfield, NJ (US)
Filed on Feb. 8, 2016, as Appl. No. 15/017,975.
Application 15/017,975 is a division of application No. 13/287,820, filed on Nov. 2, 2011, granted, now 10,535,628.
Claims priority of provisional application 61/409,775, filed on Nov. 3, 2010.
Prior Publication US 2016/0225737 A1, Aug. 4, 2016
Int. Cl. H01L 23/00 (2006.01); B22F 1/05 (2022.01); B22F 1/10 (2022.01)
CPC H01L 24/83 (2013.01) [B22F 1/05 (2022.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); B22F 1/10 (2022.01); H01L 2224/27436 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29399 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/014 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for attachment, comprising:
applying a film of metal particles to a polymeric, glass, metal, paper, or ceramic substrate, wherein applying the film comprises casting the film;
drying the film on the polymeric, glass, metal, paper, or ceramic substrate;
transferring the dried film by a lamination process at a temperature of from about 50 to about 175° C. and a pressure of from about 0.05 to about 3 MPa directly from the polymeric, glass, metal, paper, or ceramic substrate to a substrate which will subsequently receive one or more components comprising a die, wherein the dried film is in contact with the polymeric, glass, metal, paper, or ceramic substrate during lamination to the substrate which will subsequently receive said one or more components;
placing said one or more components on the transferred film to form an assembly;
applying a pressure of from about 0.5 MPa to about 20 MPa to the assembly; and
sintering the assembly at a temperature of about 175 to about 400° C. for about 0.25 seconds to about 30 minutes;
wherein the film comprises a composition comprising:
a metal powder having a d50 range of 0.001 to 10 micrometers, the metal powder comprising 30 to 95 wt. % of the composition; and
a binder having a softening point between about 90° C. and 170° C., the binder comprising 0.1 to 0.8 wt. % of the composition;
wherein the composition has a viscosity of from about 10 to about 200,000 cP.