US 12,438,118 B2
Bonding tool and bonding method thereof
Chih-Yuan Chiu, Hsinchu County (TW); Shih-Yen Chen, Hsinchu (TW); Chi-Chun Peng, Hsinchu (TW); Hong-Kun Chen, Hsinchu (TW); and Hui-Ting Lin, Tainan (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on May 3, 2024, as Appl. No. 18/654,016.
Application 18/654,016 is a continuation of application No. 17/672,285, filed on Feb. 15, 2022, granted, now 12,009,337.
Claims priority of provisional application 63/227,805, filed on Jul. 30, 2021.
Prior Publication US 2024/0297143 A1, Sep. 5, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 21/683 (2006.01)
CPC H01L 24/74 (2013.01) [H01L 21/6838 (2013.01); H01L 24/80 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80047 (2013.01); H01L 2224/80132 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80908 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
attaching a semiconductor die to a bonding tool having a first surface, wherein the bonding tool comprises a plurality of vacuum holes and a bending member movably arranged in a trench of the bonding tool, wherein the plurality of vacuum holes provide a vacuum force to hold the semiconductor die, and the bending member protrudes from the first surface and bends the semiconductor die;
causing a partial bonding at a portion of the semiconductor die and a semiconductor wafer, the portion overlapping the bending member from a top-view perspective;
causing a full bonding between the semiconductor die and the semiconductor wafer subsequent to the partial bonding while keeping the vacuum force to hold the semiconductor die at the same time; and
releasing the semiconductor die from the bonding tool by removing the vacuum force subsequent to the full bonding.