US 12,438,117 B2
Die bonding systems, and methods of using the same
Andreas Marte, Berg (CH); Daniel Buergi, Berg (CH); Urban Ernst, Berg (CH); Eirini Kakkava, Zurich (CH); Alexander Holzer, Zurich (CH); Mathias Moser, Zurich (CH); and Fabian Schneider, Zurich (CH)
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed by Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed on Nov. 17, 2022, as Appl. No. 17/988,974.
Claims priority of provisional application 63/281,948, filed on Nov. 22, 2021.
Prior Publication US 2023/0163095 A1, May 25, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/74 (2013.01) [H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/0213 (2013.01); H01L 2224/08221 (2013.01); H01L 2224/80007 (2013.01); H01L 2224/8013 (2013.01); H01L 2224/80132 (2013.01); H01L 2224/8017 (2013.01); H01L 2224/8018 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80986 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A die bonding system comprising:
a bond head assembly for bonding a single die to a substrate, the bond head assembly including a bond tool for holding the die prior to bonding the die to the substrate, the bond head assembly including a motion system for moving the bond tool along a plurality of axes prior to bonding of the die to the substrate, the die including a first plurality of fiducial markings, the substrate including a second plurality of fiducial markings; and
an imaging system configured for simultaneously imaging (i) one of the first plurality of fiducial markings and (ii) one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly, the imaging system being carried by the bond head assembly,
the imaging system configured for simultaneously imaging (i) another of the first plurality of fiducial markings and (ii) another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly,
each of the first optical path and the second optical path being independently configurable to image any area of the die including one of the first plurality of fiducial markings.