US 12,438,116 B2
Bonding apparatus and method of controlling the same
Tae Woo Kang, Changwon-si (KR); Ji Hwan Bae, Changwon-si (KR); and Yong Hyun Lee, Changwon-si (KR)
Assigned to HANWHA PRECISION MACHINERY CO., LTD., Changwon-si (KR)
Filed by HANWHA PRECISION MACHINERY CO., LTD., Changwon-si (KR)
Filed on Aug. 16, 2022, as Appl. No. 17/888,771.
Claims priority of application No. 10-2021-0125867 (KR), filed on Sep. 23, 2021.
Prior Publication US 2023/0089276 A1, Mar. 23, 2023
Int. Cl. H01L 21/338 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/74 (2013.01) [H01L 24/80 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80908 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A bonding apparatus comprising:
a bonding head;
a wafer chuck configured to receive a wafer thereon; and
at least one bonding stage cover on the wafer chuck,
wherein the bonding head is sealed, and
wherein a bonding-head vacuum suction device is inside the bonding head, and configured to remove foreign substances from an inner region of the bonding head.