US 12,438,114 B2
Flex bonded integrated circuits
Sandeep Rekhi, San Jose, CA (US); and Pradip Sairam Pichumani, Bellevue, WA (US)
Assigned to Meta Platforms, Inc., Menlo Park, CA (US)
Filed by Meta Platforms, Inc., Menlo Park, CA (US)
Filed on Mar. 18, 2022, as Appl. No. 17/698,134.
Prior Publication US 2023/0299035 A1, Sep. 21, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/552 (2006.01)
CPC H01L 24/40 (2013.01) [H01L 23/552 (2013.01); H01L 24/77 (2013.01); H01L 24/84 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/77343 (2013.01); H01L 2224/7755 (2013.01); H01L 2224/84047 (2013.01); H01L 2224/8412 (2013.01); H01L 2224/84207 (2013.01); H01L 2924/3025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit package comprising:
an integrated circuit die implementing an integrated circuit, the integrated circuit die comprising a first plurality of contacts;
a package substrate comprising a second plurality of contacts, each contact of the second plurality of contacts configured to be coupled to a contact of the first plurality of contacts; and
a flex cable comprising:
an insulating housing made of an insulating material, and
a plurality of conductors embedded inside the insulating housing, each conductor of the plurality of conductors connected to a first contact of the first plurality of contacts and a second contact of the second plurality of contacts, wherein the plurality of conductors comprises a first set of conductors arranged in a first conductor layer formed in a first plane and a second set of conductors arranged in a second conductor layer formed in a second plane parallel to and spaced from the first plane in a first direction, wherein the second set of conductors are offset from the first set of conductors along a second direction normal to the first direction, wherein the flex cable is cut at an angle through the flex cable from a first surface of the flex cable to a second surface of the flex cable to expose the first set of conductors and the second set of conductors.