US 12,438,113 B2
Conductive adhesive assembly for semiconductor die attachment
Ramesh Nallavelli, Sangareddy (IN); Nagavenkata Varaprasad Nune, Hyderabad (IN); Yeow Chon Ong, Toa Payoh (SG); and Hong Wan Ng, Singapore (SG)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 18, 2022, as Appl. No. 17/890,734.
Prior Publication US 2024/0063165 A1, Feb. 22, 2024
Int. Cl. H01L 23/00 (2006.01); C09J 9/02 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/32 (2013.01) [C09J 9/02 (2013.01); H01L 24/29 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); C09J 2203/326 (2013.01); C09J 2301/314 (2020.08); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/13193 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/07812 (2013.01); H01L 2924/1434 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A semiconductor device assembly, comprising:
a first semiconductor die;
a second semiconductor die in a stacked arrangement with the first semiconductor die; and
an adhesive assembly, between the first semiconductor die and the second semiconductor die, comprising:
one or more adhesive films; and
one or more conductive elements joined with the one or more adhesive films,
wherein the one or more adhesive films prevent contact between the one or more conductive elements and the first semiconductor die and prevent contact between the one or more conductive elements and the second semiconductor die.