US 12,438,110 B2
Fingerprint sensor and manufacturing method thereof
Sung Sun Park, Seoul (KR); Ji Young Chung, Seongnam-si (KR); and Christopher Berry, Chandler, AZ (US)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on May 17, 2024, as Appl. No. 18/667,720.
Application 18/667,720 is a continuation of application No. 17/867,287, filed on Jul. 18, 2022, granted, now 11,990,435.
Application 17/867,287 is a continuation of application No. 16/601,928, filed on Oct. 15, 2019, granted, now 11,393,734, issued on Jul. 19, 2022.
Application 16/601,928 is a continuation of application No. 15/591,416, filed on May 10, 2017, granted, now 10,446,455, issued on Oct. 15, 2019.
Application 15/591,416 is a continuation of application No. 15/131,967, filed on Apr. 18, 2016, granted, now 10,297,515, issued on May 21, 2019.
Claims priority of application No. 10-2015-0065900 (KR), filed on May 12, 2015.
Prior Publication US 2024/0304577 A1, Sep. 12, 2024
Int. Cl. H01L 23/00 (2006.01); G06V 40/13 (2022.01); H01L 23/31 (2006.01)
CPC H01L 24/05 (2013.01) [G06V 40/13 (2022.01); G06V 40/1329 (2022.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 23/3128 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/33 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a substrate comprising:
an upper substrate side, a bottom substrate side, and lateral substrate sides between the upper and bottom substrate sides;
a dielectric structure; and
a conductive structure;
a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die comprises a sensing unit;
a plurality of first conductive interconnection structures electrically coupling the sensing unit of the semiconductor die to the top substrate side;
a plate over the top die side;
an adhesive material adhered to the top die side and a bottom side of the plate; and
an encapsulant surrounding the semiconductor die, wherein the encapsulant extends above the top die side and contacts the plate.