US 12,438,097 B2
Integrated power module
Daniel John Martin, Fayetteville, AR (US); Brett Edward Sparkman, Springdale, AR (US); Ty McNutt, Farmington, AR (US); and Paul Wheeler, Allen, TX (US)
Assigned to Wolfspeed, Inc., Durham, NC (US)
Filed by WOLFSPEED, INC., Durham, NC (US)
Filed on Jan. 31, 2023, as Appl. No. 18/161,983.
Application 18/161,983 is a continuation of application No. 17/178,435, filed on Feb. 18, 2021, granted, now 11,569,174.
Prior Publication US 2023/0170306 A1, Jun. 1, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 25/18 (2023.01); H02M 3/335 (2006.01); H02M 7/00 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 25/18 (2013.01); H02M 3/33576 (2013.01); H02M 7/003 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A power module comprising:
a power substrate comprising a plurality of conductive traces;
a plurality of power semiconductor die mounted on the power substrate and electrically coupled to the plurality of conductive traces; and
a plurality of connector pins, each electrically coupled to a different one of the plurality of conductive traces, wherein the plurality of connector pins are configured to be interconnected such that the plurality of power semiconductor die provide an active front-end and a switching power converter.