US 12,438,094 B2
Electronic package and manufacturing method thereof
Yi-Min Fu, Taichung (TW); Chi-Ching Ho, Taichung (TW); Chao-Chiang Pu, Taichung (TW); and Yu-Po Wang, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Aug. 29, 2022, as Appl. No. 17/897,523.
Claims priority of application No. 111104761 (TW), filed on Feb. 9, 2022.
Prior Publication US 2023/0253331 A1, Aug. 10, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01)
CPC H01L 23/5381 (2013.01) [H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/107 (2013.01); H01L 2924/182 (2013.01); H01L 2924/3511 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a substrate structure having a circuit layer;
an electronic module disposed on the substrate structure and electrically connected to the circuit layer, wherein the electronic module comprises a first package layer;
at least one support member disposed on the substrate structure and located at a periphery of the electronic module, wherein the at least one support member is electrically connected to the circuit layer; and
a second package layer formed on the substrate structure to cover the at least one support member and the electronic module, wherein a hardness of the first package layer is greater than a hardness of the second package layer.