US 12,438,093 B2
Microelectronic structures including bridges
Omkar G. Karhade, Chandler, AZ (US); and Nitin A. Deshpande, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 18, 2020, as Appl. No. 17/126,629.
Prior Publication US 2022/0199535 A1, Jun. 23, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5381 (2013.01) [H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/3185 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a first microelectronic component;
a second microelectronic component;
a bridge component, wherein the first microelectronic component is coupled to a first face of the bridge component and the second microelectronic component is coupled to the first face of the bridge component, the bridge component has a second face opposite the first face, and the bridge component includes first conductive contacts at the second face; and
a substrate having third conductive contacts, wherein the bridge component is at least partially between the first microelectronic component and the substrate, the bridge component is at least partially between the second microelectronic component and the substrate, the first conductive contacts are connected to second conductive contacts by first solder, the second conductive contacts and the first solder are embedded in an insulating material that is between the second face of the bridge component and the substrate, the second conductive contacts are connected to the third conductive contacts by second solder, the second conductive contacts are between the first conductive contacts and the third conductive contacts, the second solder is partially surrounded by underfill material, the second solder is partially surrounded by surface insulation material between the underfill material and a face of the substrate facing the second face of the bridge component, and the underfill material is between the insulating material and the surface insulation material.