| CPC H01L 23/535 (2013.01) [H01L 21/28088 (2013.01); H01L 23/528 (2013.01); H10D 64/017 (2025.01); H10D 64/667 (2025.01); H10D 84/0179 (2025.01); H10D 84/0186 (2025.01); H10D 84/038 (2025.01); H10D 84/85 (2025.01)] | 1 Claim |

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1. A semiconductor device, comprising:
a substrate having a NMOS region and a PMOS region;
a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate;
a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region;
a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region;
a first contact plug landing on the second source/drain region adjacent to one side of the metal gate;
a second contact plug landing on the second source/drain region adjacent to another side of the metal gate;
a third contact plug landing directly on a portion of the metal gate on the PMOS region not between the first source/drain region and the second source/drain region, away from a boundary separating the NMOS region and the PMOS region, and near an end of the metal gate on the PMOS region; and
a fourth contact plug landing on the first source/drain region adjacent to one side of the metal gate.
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