| CPC H01L 23/53276 (2013.01) [C01B 32/194 (2017.08); H01L 23/53295 (2013.01); C01B 2204/22 (2013.01); C01P 2002/08 (2013.01); C01P 2004/20 (2013.01); C01P 2006/40 (2013.01)] | 16 Claims |

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1. A conducting thin film structure or pattern which facilitates the insertion of dopant atoms, ions, or molecules into layered 2D materials, the film structure comprising:
a layered 2D material,
an electrically isolative material,
wherein said electrically isolative material is disposed below said layered 2D material,
wherein said layered 2D material is multilayered graphene,
wherein said layered 2D material comprises slots,
wherein said slots comprise etched regions where said layered 2D material is at least partially etched away,
wherein said etched regions comprise a width greater than 0.5 nm and less than 1 meter,
wherein said layered 2D material is intercalation doped with at least one dopant,
wherein said at least one dopant comprises at least one intercalation doping agent,
wherein said at least one intercalation doping agent is either p-type or n-type,
wherein a first portion of said layered 2D material is doped p-type, and
wherein a second portion of said layered 2D material is doped n-type.
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