| CPC H01L 23/49833 (2013.01) [H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01)] | 3 Claims |
|
1. A semiconductor apparatus, comprising:
a first substrate having a first major surface and a plurality of first conductive pads on the first major surface;
a second substrate having a second major surface opposing the first major surface, and having a plurality of second conductive pads on the second major surface;
a semiconductor device disposed between the first substrate and the second substrate and mounted on the first major surface of the first substrate;
a plurality of bonding members that bond the first conductive pads and the second conductive pads together; and
a mold resin filling a gap between the first substrate and the second substrate,
wherein in a plan view normal to the first major surface,
the first substrate has a rectangular plane shape with a first side and a second side each extending parallel to a first direction, and a third side and a fourth side each extending parallel to a second direction perpendicular to the first direction,
the semiconductor device has a rectangular plane shape with a fifth side and a sixth side each extending parallel to the first direction, and a seventh side and an eighth side each extending parallel to the second direction,
the fifth side and the sixth side are longer than the seventh side and the eighth side,
the fifth side is closer to the first side than is the sixth side,
the seventh side is closer to the third side than is the eighth side,
part of the bonding members are arranged in two or more first rows extending parallel to the first direction between the first side and the fifth side,
part of the bonding members are arranged in two or more second rows extending parallel to the first direction between the second side and the sixth side,
part of the bonding members are arranged in one or more third rows extending parallel to the second direction between the third side and the seventh side,
part of the bonding members are arranged in one or more fourth rows extending parallel to the second direction between the fourth side and the eighth side, and
a number of rows in the third rows and a number of rows in the fourth rows are each less than both a number of rows in the first rows and a number of rows in the second rows,
wherein the bonding members each include a conductive core ball containing copper and a solder layer covering a surface of the conductive core ball, the conductive core ball being in direct physical contact with a corresponding one of the first conductive pads and a corresponding one of the second conductive pads, and
wherein a first distance between the fifth side and the first rows and a second distance between the sixth side and the second rows are each less than or equal to 1.5 times a third distance between the seventh side and the third rows, and less than or equal to 1.5 times a fourth distance between the eighth side and the fourth rows.
|