US 12,438,073 B2
Window ball grid array (WBGA) package
Wu-Der Yang, Taoyuan (TW)
Assigned to NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed by NANYA TECHNOLOGY CORPORATION, New Taipei (TW)
Filed on May 9, 2022, as Appl. No. 17/739,427.
Prior Publication US 2023/0361012 A1, Nov. 9, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49816 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05578 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/4917 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73215 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/182 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A window ball grid array (WBGA) package, comprising:
a carrier having a first surface and a second surface opposite to the first surface of the carrier, wherein the carrier has a through hole filled with a first package body and extending between the first surface and the second surface of the carrier;
an electronic component disposed on the second surface of the carrier, wherein the electronic component includes a first bonding pad and a second bonding pad; and
a first bonding wire electrically connected between the first bonding pad and the second bonding pad;
wherein the first bonding pad and the second bonding pad are extended within the through hole of the carrier, such that at least a portion of the first bonding wire is disposed within the through hole to electrically connect the first bonding pad and the second bonding pad.