US 12,438,071 B2
Semiconductor module and method for manufacturing semiconductor module
Kazuki Kuwata, Nisshin (JP); Hiroshi Ishino, Nisshin (JP); Hirokazu Sampei, Nisshin (JP); and Masaru Narikawa, Nisshin (JP)
Assigned to DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed by DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed on Mar. 10, 2023, as Appl. No. 18/181,618.
Claims priority of application No. 2022-082427 (JP), filed on May 19, 2022.
Prior Publication US 2023/0411260 A1, Dec. 21, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3114 (2013.01); H01L 23/49838 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a semiconductor chip;
a resin molded part that seals the semiconductor chip;
a first connection terminal that is electrically connected to the semiconductor chip;
a second connection terminal that is electrically connected to the semiconductor chip; and
a control terminal that is electrically connected to the semiconductor chip, wherein
the resin molded part has a predetermined surface, and an opening portion on a surface different from the predetermined surface,
the first connection terminal and the second connection terminal each have a plate shape,
the second connection terminal extends in a first direction in the resin molded part and projects from the predetermined surface of the resin molded part,
the first connection terminal includes an internal terminal and an external terminal,
the internal terminal is disposed in the resin molded part to extend along the first direction and overlap with the second connection terminal with a predetermined space therebetween in a second direction, and is exposed from the opening portion,
the external terminal is connected to the internal terminal at the opening portion and projects outside the resin molded part, and
the first connection terminal includes a tie bar remaining portion extending from the internal terminal in a direction that intersects the second direction and the first direction.