US 12,438,068 B2
Stacked module arrangement
Peter Luniewski, Poing (DE); Ivan Nikitin, Regensburg (DE); and Bernd Schmoelzer, Radenthein (AT)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Jan. 18, 2022, as Appl. No. 17/577,879.
Prior Publication US 2023/0230905 A1, Jul. 20, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/055 (2006.01); H01L 23/31 (2006.01); H01R 12/58 (2011.01); H01R 12/70 (2011.01)
CPC H01L 23/49568 (2013.01) [H01L 23/055 (2013.01); H01L 23/3114 (2013.01); H01R 12/585 (2013.01); H01R 12/7064 (2013.01); H05K 2201/1059 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A stacked module arrangement, comprising:
a first molded electronic module;
a second molded electronic module; and
an interface by which the first molded electronic module and the second molded electronic module are physically and electrically connected to one another in a stacked configuration,
wherein the first molded electronic module is a power electronic module having a maximum breakdown voltage of at least 40V and a maximum DC current of at least 10 A, and
wherein the interface is a press-fit interface that comprises a plurality of press-fit connectors protruding through a molded body of the first molded electronic module and received by a corresponding plurality of openings in a molded body of the second molded electronic module.