US 12,438,066 B2
Package structure for power converter and manufacture method thereof
Jiaming Ye, Hangzhou (CN)
Assigned to Silergy Semiconductor Technology (Hangzhou) LTD, Hangzhou (CN)
Filed by Silergy Semiconductor Technology (Hangzhou) LTD, Hangzhou (CN)
Filed on Jun. 7, 2021, as Appl. No. 17/340,241.
Application 17/340,241 is a continuation of application No. 16/109,980, filed on Aug. 23, 2018, granted, now 11,056,421.
Application 16/109,980 is a continuation of application No. 15/001,397, filed on Jan. 20, 2016, granted, now 10,083,895, issued on Sep. 25, 2018.
Claims priority of application No. 201510035298.4 (CN), filed on Jan. 23, 2015.
Prior Publication US 2021/0296213 A1, Sep. 23, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/49503 (2013.01) [H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 25/16 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A package structure of a power converter, the package structure comprising:
a) a die pad;
b) an insulation adhesive layer on said die pad;
c) a conductive adhesive layer on said die pad;
d) a control circuit die on said insulation adhesive layer, wherein said insulation adhesive layer comprises a first insulation adhesive layer on a back surface of said control circuit die, and a second insulation adhesive layer on a surface of said die pad, wherein said first insulation adhesive layer is connected to said second insulation adhesive layer, and wherein a thickness of said first insulation adhesive layer is greater than a thickness of said second insulation adhesive layer;
e) a power device die on said conductive adhesive layer, wherein said insulation adhesive layer is separated from said conductive adhesive layer; and
f) a groove that is integrally formed with said die pad and located between said conductive adhesive layer and said insulation adhesive layer, said groove being a single structure placed in order to block a flow of said conductive adhesive layer, wherein said groove extends a width of said die pad.