US 12,438,063 B2
Electronic module including a semiconductor package disposed on an interposer layer
Edward Fuergut, Dasing (DE); Davide Chiola, Villach St. Georgen (AT); Martin Gruber, Schwandorf (DE); and Wolfram Hable, Neumarkt (DE)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Feb. 22, 2024, as Appl. No. 18/583,955.
Application 18/583,955 is a continuation of application No. 17/151,267, filed on Jan. 18, 2021, granted, now 11,955,407.
Claims priority of application No. 20152688 (EP), filed on Jan. 20, 2020.
Prior Publication US 2024/0194566 A1, Jun. 13, 2024
Int. Cl. H01L 23/473 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 25/072 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic module, comprising:
a semiconductor package comprising a die carrier, a semiconductor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant;
an interposer layer, wherein the semiconductor package is disposed on the interposer layer; and
a heat sink,
wherein the interposer layer is disposed on the heatsink,
wherein the semiconductor package is soldered, diffusion soldered, or sintered onto the interposer layer, or connected to the interposer layer by a conductive glue or a silver conductive glue.