US 12,438,062 B2
Polymerized thermal interface material with surface modified liquid metal spheres and method of making
Mayank Mayukh, Fort Collins, CO (US); Shrikara Prabhu Tendel, Singapore (SG); Sam Karikalan, Irvine, CA (US); and Nicole A Butel, Fort Collins, CO (US)
Assigned to Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed by Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed on Jul. 30, 2021, as Appl. No. 17/390,474.
Prior Publication US 2023/0034217 A1, Feb. 2, 2023
Int. Cl. H01L 23/48 (2006.01); C09K 5/10 (2006.01); C09K 5/14 (2006.01); H01L 21/52 (2006.01); H01L 23/373 (2006.01); H01L 23/52 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H01L 23/3737 (2013.01) [C09K 5/10 (2013.01); C09K 5/14 (2013.01); H01L 21/52 (2013.01); H01L 23/3733 (2013.01); H01L 23/3675 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a one or more die;
a package substrate;
a thermal interface material; and
a cover disposed over the one or more die, wherein the thermal interface material comprises a modified liquid metal material and a first monomer, wherein the first monomer is chemically bonded to the modified liquid metal material, wherein the modified liquid metal material comprises a second monomer comprising a first group directly bonded to a metal material of the modified liquid metal material, wherein the first group comprises at least one of the following groups:

OG Complex Work Unit Chemistry