US 12,438,061 B2
Method of design and manufacture of a power electronics converter for an electrical power system, power electronics converter for an aircraft, and an aircraft
Uwe Waltrich, Forchheim (DE); Stanley Buchert, Herzogenaurach (DE); Marco Bohlländer, Hirschaid (DE); and Claus Müller, Wolfratshausen (DE)
Assigned to Rolls-Royce Deutschland Ltd & Co KG, Blankenfelde-Mahlow (DE)
Filed by Rolls-Royce Deutschland Ltd & Co KG, Blankenfelde-Mahlow (DE)
Filed on Jan. 24, 2023, as Appl. No. 18/101,051.
Claims priority of application No. 10 2022 205 493.8 (DE), filed on May 31, 2022.
Prior Publication US 2023/0387909 A1, Nov. 30, 2023
Int. Cl. H01L 23/36 (2006.01); B60L 50/00 (2019.01); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2006.01); H02M 1/00 (2006.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01); H02M 7/219 (2006.01); H02P 27/06 (2006.01); H03K 17/56 (2006.01); H05K 1/14 (2006.01); B64D 27/02 (2006.01)
CPC H01L 23/36 (2013.01) [B60L 50/00 (2019.02); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2013.01); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 7/003 (2013.01); H02M 7/219 (2013.01); H02P 27/06 (2013.01); H03K 17/56 (2013.01); H05K 1/144 (2013.01); B60L 2200/10 (2013.01); B60L 2210/30 (2013.01); B64D 27/026 (2024.01)] 17 Claims
OG exemplary drawing
 
1. A method of designing and manufacturing a power electronics converter for an electrical power system, the method comprising:
selecting a circuit design for the power electronics converter;
determining a shape constraint for integrating the power electronics converter into the electrical power system;
obtaining a multi-layer carrier substrate according to the determined shape constraint;
obtaining a plurality of power semiconductor prepackages, each power semiconductor prepackage of the plurality of power semiconductor prepackages including at least one power semiconductor switching element embedded in a solid insulating material and at least one electrical connection extending through the solid insulating material from at least one terminal of the at least one power semiconductor switching element to a connection surface of the respective power semiconductor prepackage of the plurality of power semiconductor prepackages; and
assembling the power electronics converter, the assembling comprising forming electrically conductive connections in a z-direction connecting terminals of the power semiconductor switching elements of the plurality of power semiconductor prepackages and one or more electrically conductive layers of the multi-layer carrier substrate, the z-direction being perpendicular to an x-y plane of the multi-layer carrier substrate and the one or more electrically conductive layers.