US 12,438,058 B2
Semiconductor apparatus
Tadahiko Sato, Matsumoto (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Feb. 24, 2023, as Appl. No. 18/173,912.
Claims priority of application No. 2022-066195 (JP), filed on Apr. 13, 2022.
Prior Publication US 2023/0335448 A1, Oct. 19, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/053 (2006.01)
CPC H01L 23/053 (2013.01) [H01L 21/4853 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 24/48 (2013.01); H01L 2224/48157 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor apparatus comprising:
a base;
an insulating substrate arranged on the base;
a semiconductor element arranged on the insulating substrate;
a case joined to the base and housing the semiconductor element; and
a sealing material supplied in the case, wherein:
the case includes a terminal block that extends in a first direction from an inner wall surface of the case,
the terminal block is arranged thereon a terminal that is electrically connected to the semiconductor element via a wiring member,
the terminal block includes a projecting portion that extends, in plan view, in the first direction from a first position of a distal end portion of the terminal to a second position, and
a first distance between the first position and the second position is at least 1 mm.