| CPC H01L 22/12 (2013.01) [H01L 22/34 (2013.01)] | 20 Claims |

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1. A semiconductor device, comprising:
a metal pattern within a device region of a substrate; and
a macro pattern structure within a scribe lane region of the substrate,
wherein the macro pattern structure includes a plurality of types of macro patterns,
wherein each type of macro pattern of the plurality of types of macro patterns includes a first pattern and a second pattern adjacent to the first pattern,
wherein the first pattern and the second pattern each include at least one conductive line extending in a first direction that is parallel to a surface of the substrate,
wherein the first pattern and the second pattern are arranged alternately in a second direction perpendicular to the first direction and parallel to the surface of the substrate, and
wherein the first pattern and the second pattern are different from one another.
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