US 12,438,051 B2
Dicing system and dicing method
Hiroshi Benno, Osaka (JP); and Koji Tamura, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/763,276
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Sep. 1, 2020, PCT No. PCT/JP2020/033112
§ 371(c)(1), (2) Date Mar. 24, 2022,
PCT Pub. No. WO2021/059900, PCT Pub. Date Apr. 1, 2021.
Claims priority of application No. 2019-177075 (JP), filed on Sep. 27, 2019.
Prior Publication US 2022/0392807 A1, Dec. 8, 2022
Int. Cl. H01L 21/78 (2006.01); G05B 19/4155 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/78 (2013.01) [G05B 19/4155 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 22/20 (2013.01); G05B 2219/45212 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A dicing system comprising:
a protection layer forming apparatus that forms a protection layer on a surface of a substrate;
a patterning apparatus that patterns the protection layer to form a mask;
a plasma treatment apparatus that plasma etches the substrate exposed from the mask to form a plurality of element chips;
a measuring apparatus that obtains at least one processing data selected from the group consisting of first processing data relating to the protection layer, second processing data relating to the mask, and third processing data relating to the element chips; and
a control unit that operates at least one apparatus selected from the group consisting of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on a recipe that is defined for each of the apparatuses,
wherein the control unit determines, based on the third processing data, whether or not to modify the recipe, modifies at least one of the recipes if the recipe needs to be modified, and operates at least one apparatus selected from the group consisting of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on the modified recipe.
 
13. A dicing method comprising:
a protection layer forming step of forming, based on a first recipe, a protection layer on a surface of a substrate;
a patterning step of patterning, based on a second recipe, the protection layer to form a mask;
a plasma treatment step of plasma etching, based on a third recipe, the substrate exposed from the mask to form a plurality of element chips;
a measuring step of obtaining second processing data relating to the mask;
a third recipe modifying step of determining, based on the obtained second processing data, whether or not to modify the third recipe, and modifying the third recipe if the third recipe needs to be modified; and
a feedforward step of feeding forward the modified third recipe to control of the plasma treatment step.