US 12,438,033 B2
Substrate placing method and substrate placing mechanism
Koichi Nakajima, Yamanashi (JP); Kentaro Asakura, Yamanashi (JP); and Yasuyuki Kagaya, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Oct. 12, 2022, as Appl. No. 17/964,708.
Claims priority of application No. 2021-171591 (JP), filed on Oct. 20, 2021.
Prior Publication US 2023/0122317 A1, Apr. 20, 2023
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/68742 (2013.01) [H01L 21/67103 (2013.01); H01L 21/6831 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate placing method for placing a substrate on a placing surface of a placing table in a chamber of a substrate processing apparatus for processing a substrate, the placing table having the placing surface on which a substrate is placed and a tapered surface for guiding the substrate disposed at an outer periphery of the placing surface, the method comprising,
locating a lift pin to a substrate transfer position over the placing surface, the lift pin being capable of protruding from and retracting below the placing surface, and transferring the substrate onto the lift pin;
lowering the lift pin, on which the substrate is placed, to a substrate placing position lower than the placing surface; and
raising the lift pin by a short distance and then returning the lift pin to the substrate placing position,
wherein when an edge of the substrate is caught on the tapered surface while lowering the lift pin from the substrate transfer position to the substrate placing position, a state in which the edge is caught on the tapered surface is released and the substrate is guided to the placing surface, by said raising the lift pin by the short distance and then returning the lift pin to the substrate placing position.