| CPC H01L 21/6835 (2013.01) [H01L 25/0753 (2013.01); H10H 20/857 (2025.01); B65G 43/10 (2013.01); H01L 2221/68309 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01)] | 11 Claims |
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1. An apparatus for transferring light emitting diode (LED) chips, comprising:
a tunable first light source configured to generate and emit first light rays and second light rays, wherein a wavelength of the first light rays and a wavelength of the second light rays are different;
a first support structure configured to carry a load substrate, the load substrate comprising a light-transmissive substrate and the LED chips fixed on a side of the light-transmissive substrate away from the tunable first light source by dissociation adhesive;
a second support structure configured to carry a to-be-transferred substrate, the to-be-transferred substrate being on a side of the LED chips away from the light-transmissive substrate; and
an optical control mechanism on a side of the light-transmissive substrate away from the LED chips and configured to control a propagation direction of the first light rays that irradiate onto a first radiation region of the optical control mechanism to form target light rays that irradiate onto a target radiation region of the load substrate, so that the dissociation adhesive in the target radiation region is dissociated to transfer the LED chips in the target radiation region to the to-be-transferred substrate,
wherein the second light rays is configured to pass through the optical control mechanism and irradiate onto the load substrate so as to excite the LED chips to emit light; and
the second light rays and the dissociation adhesive are configured such that the dissociation adhesive is not dissociated in a case where being subjected to irradiation of the second light rays,
wherein the optical control mechanism comprises: an optical filter device;
the optical filter device comprises: a plurality of optical control elements arranged in an array, the optical control elements located in the first radiation region being in an active state, and the optical control elements not located in the first radiation region being in an inactive state; and
each of the plurality of optical control elements is configured to control a propagation direction of the received first light rays in response to the optical control element being in the active state, so as to form the target light ray that irradiates onto the target radiation region of the load substrate,
wherein the optical control element is configured to reflect the first light rays that irradiate onto the optical control element to the load substrate in response to the optical control element being in the active state and to reflect the first light rays that irradiate onto the optical control element to a redundant light region in response to the optical control element being in the inactive state, and
the redundant light region is on a side of the optical control mechanism away from the load substrate,
wherein the optical filter device comprises: a reflective digital micro-mirror device;
the reflective digital micro-mirror comprises a plurality of second pixel units, each of the plurality of second pixel units serving as a corresponding one of the plurality of optical control elements;
each of the plurality of second pixel unit comprises: a micro-mirror, a torsion hinge, a CMOS circuit, and an address electrode; and
the micro-mirror is coupled to the torsion hinge by a via, and the CMOS circuit is coupled to the address electrode.
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