US 12,438,029 B2
Variable capacitance device, substrate processing apparatus including the variable capacitance device, and substrate processing method
Jong Gun Lee, Chungcheongnam-do (KR); and Hyung Joon Kim, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Dec. 26, 2022, as Appl. No. 18/088,753.
Claims priority of application No. 10-2022-0094775 (KR), filed on Jul. 29, 2022.
Prior Publication US 2024/0038566 A1, Feb. 1, 2024
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 17 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a chuck member;
a ceramic puck disposed on the chuck member;
a focus ring disposed to surround the ceramic puck;
an insulating layer disposed below the focus ring to surround the chuck member;
two electrodes formed in the insulating layer, wherein a distance between the two electrodes is adjustable to form a variable capacitance; and
a sensor unit provided in a chamber where the chuck member is provided, the sensor unit sensing an electrical property in the chamber,
wherein the sensor unit senses an electrical property of a first periphery which is around the ceramic puck, and an electrical property of a second periphery, which is around the focus ring, and the distance between the two electrodes is controlled such that the electrical properties of the first and second peripheries become similar to each other.