US 12,438,028 B2
Substrate support unit, method of manufacturing the same, and substrate processing apparatus including the same
Jun Seok Park, Cheonan-si (KR); Chul Ho Jung, Pyeongtaek-si (KR); and Sang Kee Lee, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 1, 2022, as Appl. No. 18/073,437.
Claims priority of application No. 10-2021-0170956 (KR), filed on Dec. 2, 2021.
Prior Publication US 2023/0178409 A1, Jun. 8, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 21/68757 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A manufacturing method of a substrate support unit for supporting a substrate, the method comprising:
preparing a chucking component for supporting the substrate and a base component disposed under the chucking component; and
coupling a partial region of a bottom surface of the chucking component and a corresponding partial region of an upper surface of the base component to each other by brazing,
wherein the coupling comprises:
forming a metal film on the partial region of the bottom surface of the chucking component by metalizing the partial region of the bottom surface of the chucking component; and
providing, in the brazing, a metal filler between the chucking component and the base component, thereby forming a joining part by coupling the metal filler and the metal film with each other,
wherein the metal filler directly contacts the corresponding partial region of the upper surface of the base component, and
wherein the joining part includes a first area corresponding to an edge region of the base component and the chucking component and a second area surrounding a side surface of a pin hole passing through the base component and the chucking component.