US 12,438,025 B2
Substrate processing system
Dongwei Li, Nirasaki (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Mar. 10, 2023, as Appl. No. 18/120,195.
Claims priority of application No. 2022-044900 (JP), filed on Mar. 22, 2022.
Prior Publication US 2023/0307278 A1, Sep. 28, 2023
Int. Cl. H01L 21/677 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67709 (2013.01) [H01L 21/67196 (2013.01); H01L 21/67742 (2013.01); H01L 21/67745 (2013.01); H01L 21/67748 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate processing system comprising:
a module having a mounting unit on which a substrate is mounted;
a transfer chamber connected to the module; and
a substrate transfer device configured to transfer the substrate to the module,
wherein the substrate transfer device includes:
a transfer unit having a substrate holder that is configured to hold the substrate and is accessible to the mounting unit of the module, and a base that has therein a magnet and moves the substrate holder along a bottom portion of the transfer chamber; and
a planar motor having a plurality of tiles arranged along the bottom portion of the transfer chamber, a plurality of electromagnetic coils disposed in each of the plurality of tiles and supplied with power, and wherein the planar motor is configured to magnetically levitate and linearly drive the base,
wherein a tile disposed at a position corresponding to the module among the plurality of tiles is connected to the module without being connected to the transfer chamber.