US 12,438,023 B2
Rounded vertical wafer vessel rods
Ching-Wen Cheng, Zhubei (TW); Xin-Kai Huang, Hsinchu (TW); and Kuei-Hsiung Cho, Xinpu Township (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Jan. 19, 2024, as Appl. No. 18/417,773.
Application 18/417,773 is a continuation of application No. 17/883,597, filed on Aug. 8, 2022, granted, now 11,908,719.
Application 17/883,597 is a continuation of application No. 16/746,049, filed on Jan. 17, 2020, granted, now 11,450,542.
Prior Publication US 2024/0203770 A1, Jun. 20, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/673 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67309 (2013.01) [C23C 16/4583 (2013.01); C23C 16/46 (2013.01); H01L 21/0217 (2013.01); H01L 21/02271 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a top base having an opening therein, wherein the top base includes a slot and is not completely circular;
a bottom base; and
at least one rod connected to the bottom base, wherein each rod of the at least one rod comprises multiple fingers.