US 12,438,021 B2
Semiconductor manufacturing apparatus and processing method of semiconductor manufacturing apparatus
Hiromichi Fujii, Hokkaido (JP); and Takashi Kunieda, Hokkaido (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Nov. 18, 2022, as Appl. No. 17/989,870.
Claims priority of application No. 2021-191717 (JP), filed on Nov. 26, 2021.
Prior Publication US 2023/0170235 A1, Jun. 1, 2023
Int. Cl. H01L 21/67 (2006.01); G05B 19/418 (2006.01)
CPC H01L 21/67276 (2013.01) [G05B 19/4183 (2013.01); H01L 21/67011 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus comprising:
an execution instruction receiving circuitry configured to receive an execution instruction for the semiconductor manufacturing apparatus to execute a predetermined process including a shutdown of the semiconductor manufacturing apparatus and related to an operation control of the semiconductor manufacturing apparatus;
an identification information receiving circuitry configured to receive an input of identification information of the semiconductor manufacturing apparatus, the identification information being used for an authentication of the semiconductor manufacturing apparatus; and
an execution circuitry configured to execute the predetermined process according to the execution instruction of the predetermined process when identification information of the semiconductor manufacturing apparatus preset in the semiconductor manufacturing apparatus is same as the identification information of the semiconductor manufacturing apparatus received by the identification information receiving circuitry.