US 12,438,020 B2
Substrate processing apparatus
Jin-Hyung Kim, Yongin-si (KR)
Assigned to TES CO., LTD, Yongin-si (KR)
Filed by TES CO., LTD, Yongin-si (KR)
Filed on Jul. 9, 2024, as Appl. No. 18/767,916.
Claims priority of application No. 10-2023-0091542 (KR), filed on Jul. 14, 2023.
Prior Publication US 2025/0022730 A1, Jan. 16, 2025
Int. Cl. H01L 21/67 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67259 (2013.01) [H01L 21/67034 (2013.01); H01L 21/67333 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a chamber providing a processing space for performing a process on a substrate coated with an organic solvent by using a fluid in a supercritical state;
a tray that supports the substrate and is to be loaded into the chamber and unloaded out of the chamber through an opening of the chamber; and
a detection sensor configured to detect tilting or offset of the tray,
wherein the detection sensor includes at least one of a first detection sensor configured to detect tilting of the tray based on a first axis (X axis) parallel to a horizontal plane, a second detection sensor configured to detect tilting of the tray based on a second axis (Y axis) parallel to the horizontal plane, and a third detection sensor configured to detect movement of the tray in the direction of the first axis (X axis),
wherein the first detection sensor includes a first tray detection sensor configured to detect a vertical distance to a lower surface of the tray and a first chamber detection sensor configured to detect a vertical distance to a lower surface of an outside of the chamber.