US 12,438,015 B2
Stamps with structured microposts
Kyle Bryant Benkendorfer, Kinsale (IE); and Ronald S. Cok, Rochester, NY (US)
Assigned to X-Celeprint Limited, Dublin (IE)
Filed by X-Celeprint Limited, Dublin (IE)
Filed on Dec. 17, 2021, as Appl. No. 17/554,310.
Prior Publication US 2023/0197479 A1, Jun. 22, 2023
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67144 (2013.01) 20 Claims
OG exemplary drawing
 
1. A micro-transfer-printing stamp, comprising:
a rigid support; and
an array of posts disposed over the rigid support, each of the posts in the array of posts extending in a direction away from the rigid support,
wherein, for each post in the array of posts, a distal end of the post has a structured three-dimensional surface comprising a first micro-post that extends a first distance away from the rigid support and a second micro-post that extends a second distance away from the rigid support, the second distance less than the first distance, and
wherein the posts in the array of posts comprise an elastomeric material.