US 12,438,014 B2
Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same
Jaehyuk Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 28, 2023, as Appl. No. 18/141,013.
Claims priority of application No. 10-2022-0115687 (KR), filed on Sep. 14, 2022.
Prior Publication US 2024/0087921 A1, Mar. 14, 2024
Int. Cl. B32B 43/00 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67132 (2013.01) [B32B 43/006 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01)] 9 Claims
OG exemplary drawing
 
1. A substrate debonding method, comprising:
irradiating light to a substrate assembly; and
after irradiating the light, separating a glass substrate of the substrate assembly from a substrate of the substrate assembly,
wherein irradiating the light to the substrate assembly comprises:
placing the substrate assembly, including the glass substrate and the substrate, on a stage of a light irradiation apparatus; and
irradiating, by a light emitting diode (LED) module of the light irradiation apparatus and through the glass substrate in a first direction towards the stage, ultraviolet (UV) radiation to an adhesion layer of the substrate assembly, the adhesion layer being between the glass substrate and the substrate,
wherein the LED module comprises a plurality of LEDs,
wherein some of the plurality of LEDs are arranged in a second direction, the second direction intersecting the first direction,
wherein others of the plurality of LEDs are arranged in a third direction, the third direction intersecting the second direction, and
wherein outermost LEDs among the plurality of LEDs are arranged in a circular shape.