US 12,438,013 B2
Batch type vertical substrate processing apparatus comprising cooling system having distributor supplying cooling fluid to plurality of first coolers and auxiliary system, and supplying merged cooling fluid to second cooler
Mikio Ono, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Mar. 17, 2022, as Appl. No. 17/697,690.
Claims priority of application No. 2021-044447 (JP), filed on Mar. 18, 2021.
Prior Publication US 2022/0301899 A1, Sep. 22, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/673 (2006.01); H05B 1/02 (2006.01)
CPC H01L 21/67109 (2013.01) [H01L 21/673 (2013.01); H05B 1/0233 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a plurality of first coolers installed in or around a process furnace configured to process a substrate, and configured to perform cooling by a cooling fluid;
a second cooler installed in or around the process furnace and configured to perform cooling by the cooling fluid, the second cooler being not included in the plurality of first coolers;
a distributor configured to distribute the cooling fluid supplied from a cooling fluid supply port to the plurality of first coolers and an auxiliary system bypassing the plurality of first coolers; and
a merging part configured to merge the cooling fluid passed through the plurality of first coolers and the cooling fluid passed through the auxiliary system, respectively, and supply the merged cooling fluid to the second cooler.