US 12,438,009 B2
Apparatus for mounting solder balls
Young-Ja Kim, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 2, 2022, as Appl. No. 18/061,229.
Claims priority of application No. 10-2021-0176261 (KR), filed on Dec. 10, 2021.
Prior Publication US 2023/0187228 A1, Jun. 15, 2023
Int. Cl. H01L 21/67 (2006.01); B23K 3/06 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01)
CPC H01L 21/67011 (2013.01) [B23K 3/0623 (2013.01); H01L 21/4853 (2013.01); H01L 21/6838 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus for mounting solder balls, the apparatus comprising:
a stage configured to support a substrate thereon;
a mounting unit configured to mount the solder balls on the substrate; and
a solder ball mask between the mounting unit and the substrate, wherein the solder ball mask includes
a first face facing the substrate, and
a second face opposite to the first face,
wherein the solder ball mask has a plurality of inner surfaces extending continuously from the first face to the second face defining a plurality of through-holes, the plurality of through-holes extending through a thickness of the solder ball mask from the second face to the first face, wherein the apparatus is configured to cause the solder balls to move through separate, respective through-holes of the plurality of through-holes,
wherein each through-hole of the plurality of through-holes includes a first opening defined in the first face, and a second opening defined in the second face,
wherein a first spacing between adjacent first openings of the plurality of through-holes is different from a second spacing between adjacent second openings of the plurality of through-holes, and
wherein at least one through-hole of the plurality of through-holes has a first sidewall and a second sidewall opposite to each other and a slope of the first sidewall is different from a slope of the second sidewall such that a center of a first opening corresponding to the at least one through-hole and a center of a second opening corresponding to the at least one through-hole of the plurality of through-holes are not aligned with each other in a vertical direction perpendicular to a plan view of the solder ball mask.