| CPC H01L 21/0334 (2013.01) [H01L 21/743 (2013.01); H01L 21/76229 (2013.01)] | 13 Claims |

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1. A method of fabricating a metal mask, comprising:
receiving a conductive substrate, wherein the conductive substrate comprises:
a first surface;
a second surface, opposite to the first surface;
a third surface, connecting the first surface and the second surface;
a fourth surface, opposite to the third surface and connecting the first surface and the second surface;
forming a plurality of trenches in a direction from the first surface to the second surface and a plurality of protrusions in the conductive substrate, wherein the plurality of the trenches and the plurality of the protrusions are alternately arranged;
filling the plurality of the trenches with a first insulation material, wherein the first insulation material covers a first area of the plurality of the protrusions;
forming a metal layer on the conductive substrate, wherein the metal layer overlies a second area of the plurality of the protrusions, and the second area is different from the first area;
removing the first insulation material; and
removing the conductive substrate such that the metal layer becomes a metal mask with a three-dimensional structure, wherein the metal mask with the three-dimensional structure comprises a plurality of strip-shaped structures.
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